Number 4 / October 2005

Research Contributions

• Nanotechnology for The Forest Products Industry

  Theodore Wegner, Philip Jones

  549-551

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• Application of the ESEM Technique in Wood Research: Part I. Optimization of Imaging Parameters and Working Conditions

  Hrvoje Turkulin, Lorenz Holzer, Klaus Richter, Juergen Sell

  552-564

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• Application of the ESEM Technique in Wood Research. Part II. Comparison of Operational Modes

  Hrvoje Turkulin, Lorenz Holzer, Klaus Richter, Juergen Sell

  565-573

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• Effects of Planting Density on Visually Graded Lumber and Mechanical Properties of Taiwania

  Song-Yung Wang, Jin-Hau Chen, Kuang-Ping Hsu

  574-581

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• The Influence of Tree Spacing in Heartwood Content in Eucalyptus Globulus Labill

  Jorge Gominho, Helena Pereira

  582-590

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• Exploration of the Physical Properties of Internal Characteristics of Sugar Maple Logs and Relationships with CT Images

  Gerson Rojas Espinoza, Roger Hernández, Alfonso Condal, Daniel Verret, Robert Beauregard

  591-604

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• Treatability of SPF Framing Lumber with CCA and Borate Preservatives

  Stan Lebow, Cherilyn Hatfield, William Abbott

  605-614

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• Determining the Transverse Dimensions of Fibers in Wood Using Confocal Microscopy

  Ho Fan Jang, Rajinder S. Seth, Cheng Bao Wu, Ben K. Chan

  615-628

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• Flexural Properties, Internal Bond Strength, and Dimensional Stability of Medium Density Fiberboard Panels Made from Hybrid Poplar Clones

  Jun Li Shi, S. Y. Zhang, Bernard Riedl, Gilles Brunette

  629-637

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• Fungi Colonizing Douglas-Fir in Cooling Towers: Identification and Their Decay Capabilities

  Gyu-Hyeok Kim, Dae-Sun Son, Jae-Jin Kim

  638-642

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• Influence of Fungal Decay and Moisture Absorption on Mechanical Properties of Extruded Wood-Plastic Composites

  Anke Schirp, Michael P. Wolcott

  643-652

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• Thermal Modification of Color in Red Alder Veneer. I. Effects of Temperature, Heating Time, and Wood Type

  Derek W. Thompson, Robert A. Kozak, Philip D. Evans

  653-661

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• Theoretical Modeling and Experimental Analyses of Laminated Wood Composite Poles

  Cheng Piao, Todd F. Shupe, Vijaya Gopu, Chung Y. Hse

  662-672

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• Probing the Hydroxymethylated Resorcinol Coupling Mechanism With Stress Relaxation

  Nanjian Sun, Charles E. Frazier

  673-681

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• Predicting Wood Thermal Conductivity Using Artificial Neural Networks

  Stavros Avramidis, Lazaros Iliadis

  682-690

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• Localized Dielectric Cure Monitoring Through the Panel Thickness During Oriented Strandboard Hot-Pressing

  Pablo J. García, Siqun Wang

  691-698

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• Geometric Model for Softwood Transverse Thermal Conductivity. Part I

  Hong-mei Gu, Audrey Zink-Sharp

  699-711

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