Properties and Wood Bonding Capacity of Nanoclay-Modified Urea and Melamine Formaldehyde Resins

Authors

  • D. Xian
  • K. E. Semple
  • S. Haghdan
  • G. D. Smith

Keywords:

Particleboard, nanoclay, bond strength, MOR, MOE, thermosetting resin, adhesion

Abstract

Urea formaldehyde (UF) and melamine formaldehyde (MF) thermosetting resins were substituted with up to 6% nanoclay (organic modified Cloisite®30B and unmodified Nanofil® 116; Southern Clay Ltd, Austin, TX) and assessed for mixing and curing compatibility using X-ray diffraction, differential scanning calorimetry, wood lap-shear tests, and particleboard strength tests. Cloisite® 30B exfoliated fully in both resin types, whereas Nanofil® 116 showed increased spacing between platelets (intercalation) but not exfoliation. Nanoclays improved bonding strength of MF more than UF resin, and 2% nanoclay with a coupling agent in MF significantly enhanced particleboard bonding strength. Also, thickness swelling of particleboard in water decreased with up to 6% nanoclay. To decrease costs, MF resin could potentially be substituted by up to 6% nanoclay with no detrimental effect on properties.

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Published

2013-10-18

Issue

Number 4 / October 2013

Section

Research Contributions

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