Properties and Wood Bonding Capacity of Nanoclay-Modified Urea and Melamine Formaldehyde Resins
Keywords:Particleboard, nanoclay, bond strength, MOR, MOE, thermosetting resin, adhesion
AbstractUrea formaldehyde (UF) and melamine formaldehyde (MF) thermosetting resins were substituted with up to 6% nanoclay (organic modified Cloisite®30B and unmodified Nanofil® 116; Southern Clay Ltd, Austin, TX) and assessed for mixing and curing compatibility using X-ray diffraction, differential scanning calorimetry, wood lap-shear tests, and particleboard strength tests. Cloisite® 30B exfoliated fully in both resin types, whereas Nanofil® 116 showed increased spacing between platelets (intercalation) but not exfoliation. Nanoclays improved bonding strength of MF more than UF resin, and 2% nanoclay with a coupling agent in MF significantly enhanced particleboard bonding strength. Also, thickness swelling of particleboard in water decreased with up to 6% nanoclay. To decrease costs, MF resin could potentially be substituted by up to 6% nanoclay with no detrimental effect on properties.
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