Comparison of the Creep Behavior of A Basswood Waferboard to that of Solid Wood
Keywords:Creep, particleboard, relative humidity, flexure, parallel-to-grain, perpendicular-to-grain
AbstractFlexural creep at 50, 60, 70, and 80% RH for parallel- and perpendicular-to-grain solid wood was compared with a laboratory-produced particleboard of the same species. Accelerated flexural creep rates at high relative humidities did not follow trends of wood stressed in tension and compression perpendicular-to-grain. Creep in particleboard lies between that parallel- and perpendicular-to-grain.
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