Comparison of the Creep Behavior of A Basswood Waferboard to that of Solid Wood

Authors

  • R. Gnanaharan
  • J. Haygreen

Keywords:

Creep, particleboard, relative humidity, flexure, parallel-to-grain, perpendicular-to-grain

Abstract

Flexural creep at 50, 60, 70, and 80% RH for parallel- and perpendicular-to-grain solid wood was compared with a laboratory-produced particleboard of the same species. Accelerated flexural creep rates at high relative humidities did not follow trends of wood stressed in tension and compression perpendicular-to-grain. Creep in particleboard lies between that parallel- and perpendicular-to-grain.

References

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Published

2007-06-28

Issue

Number 3 / Fall 1979

Section

Research Contributions

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