Simulation Modeling of Particleboard Density Profile
Keywords:Particleboard, simulation modeling, density profile, temperature profile, moisture content profile, finite difference method
AbstractParticleboard properties are affected by the vertical density profile among other factors. To predict or model board properties, one needs to determine the density profile. A simulation model was developed in this study to model the vertical density profile by simulating the hot pressing process of a particleboard. Temperature and moisture content profiles during hot pressing in the thickness direction of a pressed mat and the influential factors affecting wood compressibility were modeled such that they can be determined at any moment of pressing. The models developed allow calculations of the profiles to be carried out by either the finite difference method or an alternative approximation method presented herein. The density profile was modeled based on the compressibility and the resulting strain of each layer of the board thickness due to pressing.
Forest Products Laboratory. 1987. Wood handbook: Wood as an engineering material. Agricultural Handbook No. 72. USDA, Washington, DC.nHeebink, B. G., W. F. Lehmann, and F. V. Hefty. 1972. Reducing a particleboard pressing time: Exploratory study. Res. Pap., No. FPL180. USDA Forest Service, Forest Products Laboratory, Madison, WI.nHuang, Y-F, M. Mori, and M. Ota. 1976. Density distribution of particleboard throughout the thickness. (1) Measurement of the density distribution by soft X-ray and densitometric method. Rep. Kyushu Univ. Forest, No. 26: 149-155.nKamke, F. A., and L. J. Casey. 1988. Gas pressure and temperature in the mat during flake board manufacture. Forest Prod. J. 38(3): 41-43.nKunesh, R. H. 1961. The inelastic behavior of wood: A new concept for improved panel forming processes. Forest Prod. J. 11(9): 395-406.nLaufenberg, T. L. 1986. Using gamma radiation to measure density gradients in reconstituted wood products. Forest Prod. J. 36(2): 59-62.nMcLean, J. D. 1942. The rate of temperature change in wood panels heated between hot plates. USDA Forest Prod. Lab. Rep. No. 1299. Madison, WI.nPalka, L. C. 1973. Predicting the effect of specific gravity, moisture content, temperature, and strain rate on the elastic properties of softwoods. Wood Sci. Technol. 7(2): 127-141.nSiau, J. F. 1984. Transport processes in wood. Springer-Verlag, New York. 245 pp.nSteiner, P. R., L. A. Jozsa, M. L. Parker, and S. Chow. 1978. Application of X-ray densitometry to determine density profile in waferboard: Relationship of density to thickness expansion and internal bond strength under various cycles. Wood Sci. 11(1): 48-55.nStevens, R. R. 1978. Slicing apparatus aids in determination of layer-density of particleboard. Forest Prod. J. 28(9): 51-52.nSuo, S. 1991. Computer simulation modeling of structural particleboard properties. Ph.D. thesis, University of Minnesota, St. Paul, MN. 158 pp.n
The copyright of an article published in Wood and Fiber Science is transferred to the Society of Wood Science and Technology (for U. S. Government employees: to the extent transferable), effective if and when the article is accepted for publication. This transfer grants the Society of Wood Science and Technology permission to republish all or any part of the article in any form, e.g., reprints for sale, microfiche, proceedings, etc. However, the authors reserve the following as set forth in the Copyright Law:
1. All proprietary rights other than copyright, such as patent rights.
2. The right to grant or refuse permission to third parties to republish all or part of the article or translations thereof. In the case of whole articles, such third parties must obtain Society of Wood Science and Technology written permission as well. However, the Society may grant rights with respect to Journal issues as a whole.
3. The right to use all or part of this article in future works of their own, such as lectures, press releases, reviews, text books, or reprint books.