Bolted Timber Connections. Part I. a Wafer Technique to Model Wood Deformation Around Bolts
Keywords:
Bolted joints, wafer technique, material behavior, design optimization, tensile loadingAbstract
An experimental technique to model wood material behavior in the plane perpendicular to the axes of bolts in joint members is described. In this technique, 0.8-mm-thick wood wafers sandwiched between glass plates, with a steel pin representing a bolt passing through them, are loaded in tension. Wood deformation and failure around the pin, visible through the glass plates as loading proceeds, are photographed, and load-slip curves are also recorded. Reported tests were limited to steel pins of 12.5-mm diameter; preliminary findings suggest that information can be gained that sheds light on the effects of growth-ring orientation, wood defects, bolt end-distance, and multiple-bolt positions. The technique may be used directly, to indicate the sensitivity of joints to design factors such as those above, or indirectly, when results are combined with bolt bending data obtained with X-ray scanning.References
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