Wood-Adhesive Interface Characterization And Modeling In Engineered Wood Flooring
Keywords:
Diffusion coefficient, expansion coefficient, hygromechanical deformation, sugar maple, crosslinked polyviny1 acetateAbstract
Adhesive films used in layered wood-based composites have a significant impact on moisture movement and must be considered in models of such products. The objective of this study was to characterize the wood-adhesive interface and determine its impact on the hygromechanical behavior of engineered wood flooring (EWF). The radial water vapor diffusion coefficient and the coefficients of moisture expansion were determined for sugar maple wood, crosslinked polyviny1 acetate adhesive film (XPVAc), and the wood-adhesive interface. Sugar maple wood had the highest diffusion coefficient at 1.66 x 10-11 m2 · s-1 followed by the wood-adhesive interface at 5.73 x 10-12 m2 · s-1, and the free XPVAc film at 4.18 x 10-12 m2 · s-1. The coefficient of tangential moisture expansion of the sugar maple wood-adhesive interface was found to be 4 x 10-3 (%MC)-1 compared with 3 x 10-3 (%MC)-1 for sugar maple wood in the tangential direction, and 3 x 10-3 (%MC)-1 for the XPVAc film. Finite element modeling of EWF hygromechanical cupping did not show significant differences between hygromechanical cupping calculated with and without interface effects.References
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