Wood-Adhesive Interface Characterization And Modeling In Engineered Wood Flooring

Authors

  • Benoît Belleville
  • Pierre Blanchet
  • Alain Cloutier
  • Jean Deteix

Keywords:

Diffusion coefficient, expansion coefficient, hygromechanical deformation, sugar maple, crosslinked polyviny1 acetate

Abstract

Adhesive films used in layered wood-based composites have a significant impact on moisture movement and must be considered in models of such products. The objective of this study was to characterize the wood-adhesive interface and determine its impact on the hygromechanical behavior of engineered wood flooring (EWF). The radial water vapor diffusion coefficient and the coefficients of moisture expansion were determined for sugar maple wood, crosslinked polyviny1 acetate adhesive film (XPVAc), and the wood-adhesive interface. Sugar maple wood had the highest diffusion coefficient at 1.66 x 10-11 m2 · s-1 followed by the wood-adhesive interface at 5.73 x 10-12 m2 · s-1, and the free XPVAc film at 4.18 x 10-12 m2 · s-1. The coefficient of tangential moisture expansion of the sugar maple wood-adhesive interface was found to be 4 x 10-3 (%MC)-1 compared with 3 x 10-3 (%MC)-1 for sugar maple wood in the tangential direction, and 3 x 10-3 (%MC)-1 for the XPVAc film. Finite element modeling of EWF hygromechanical cupping did not show significant differences between hygromechanical cupping calculated with and without interface effects.

References

Anon (2003) Product Bulletin Wonderbond. WB-957. Hexion Specialty Chemicals, Inc., Columbus, OH. 1 p.nAnon (2006) L'industrie européenne du parquet en 2005 [The European parquet industry in 2005 (in French)]. European Federation of the Parquet Industry, Press release, May 30. 5 pp.nAnon (2007) Statistical report. Floor Covering Weekly, New Jersey, USA. Vol. 56, No. 10.nASTM (1995a) Standard test method for water measurement of dry-film thickness of organic coatings using micrometers. D 1005. American Society for Testing and Materials, West Conshohocken, PA.nASTM (1995b) Standard test method for water vapor transmission of materials. E 96. American Society for Testing and Materials, West Conshohocken, PA.nBaïlon JP, Dorlot JM (2000) Des Matériaux [Materials (in French)]. 3rd ed. École Polytechnique de Montréal, Montréal. 740 pp.nBandrup I, Immergut EH, Grulke EA (1999) Polymer hand- book. 4th ed. John Wiley & Sons, New York, NY. 1904 pp.nBlanchet P, Cloutier A, Gendron G, Beauregard R (2005) Numerical prediction of engineered wood flooring deformation. Wood Fiber Sci 37(3):484-496.nBodig J, Jayne BA (1993) Mechanics of wood and wood composites. Krieger Publishing Company, Malabar, FL. 712 pp.nCortelyou G (2005) Solid vs engineered: The debate goes on. Floor Covering Weekly 54(22):16-17.nDe Leeuw M (1983) Le collage du bois [The wood gluing (in French)]. Centre technique du bois (CTB), Paris, France. 84 pp.nde Moura LF 2006. Étude de trois procédés de finition des surfaces du bois d'érable à sucre pour fins de vernissage [Evaluation of varnish coating performance for three surfacing methods on sugar maple wood (in French)]. PhD Thesis. Département des sciences du bois et de la forět, Université Laval, Québec, Canada. 181 pp.nDeteix J, Blanchet P, Fortin A, Cloutier A (2008) Finite element modeling of laminate wood composites hygromechanical behavior considering diffusion effects in the adhesive. Wood Fiber Sci 40(1):132-143.nDiebels S, Steeb H, Possart W (2005) Effects of the interphase on the mechanical behavior of thin adhesive films—A modeling approach. Pages 319-335 in W Possart, ed. Adhesion, current research and applications. Wiley-VCH, Weinheim, Germany.nDjolani B (1970) Hystérèse et effets de second ordre de la sorption d'humidité dans le bois aux températures de 5°, 21°, 35° et 50°C [Wood sorption hysteresis and second order effects at 5°, 21°, 35°, and 50°C (in French)]. Research note no. 8, Département d'Exploitation et Utilisation des Bois, Université Laval, Québec. 60 pp.nGoulet M, Fortin Y (1975) Mesure du gonflement de 1'érable à sucre au cours d'un cycle de sorption d'humidité à 21°C [Swelling measure for sugar maple during a humidity sorption cycle at 21°C (in French)]. Research note no. 12, Département d'Exploitation et Utilisation des Bois, Université Laval, Québec. 49 pp.nJessome AP (2000) Strength and related properties of woods grown in Canada. Forintek Canada Corp. Special Publication SP514E. 37 pp.nPizzi A, Mittal KL (2003) Handbook of adhesive technology. 2nd ed. Marcel Dekker, NY. 1024 pp.nSiau JF (1995) Wood: Influence of moisture on physical properties. Department of Wood Science and Forest Products, Virginia Polytechnic Institute and State University, Blacksburg, VA. 227 pp.nUrayama K, Takigawa T, Masuda T (1993) Poisson's ratio of polyvinyl alcohol gels. Macromolecules 26(12):3092-3096.n

Downloads

Published

2008-11-03

Issue

Section

Research Contributions