OPTIMIZING PREPARATION CONDITIONS OF ULTRA-LOW-DENSITY FIBERBOARD BY RESPONSE SURFACE METHODOLOGY

Abstract

Preparation conditions of ultra-low-density fiberboard (ULDF) were optimized using the Box–Behnken design and response surface methodology. The effect and interactions of Si-Al molar ratio, additive amount of Si sol, and additive amount of Si-Al compounds on internal bond strength of ULDF were investigated. The regression model for ULDF preparation was significant ( p < 0.0001), and the Si-Al molar ratio and the additive amount of Si sol had a significant effect on internal bond strength, whereas the additive amount of Si-Al compounds did not. Optimum internal bond strength (12.68 ± 0.35 KPa) was achieved at 500 mL Si-Al compounds with Si-Al molar ratio of 2:1 and 20 mL Si sol. Fourier transform infrared spectra of the ULDF confirmed that some covalent bonds between Si-Al additives and fibers might be formed, and the thermal conductivity, noise reduction coefficient, and contact angle analysis of ULDF further confirmed the validity of the optimal preparation conditions.