How Overdrying Wood Reduces Its Bonding to Phenol-Formaldehyde Adhesives: A Critical Review of the Literature. Part I. Physical Responses

Authors

  • Alfred W. Christiansen

Keywords:

Drying, inactivation, adhesive, bonding, review, extractives, mechanism, wettability

Abstract

This review critically evaluates literature on the ways in which excessive drying (overdrying) inactivates wood surfaces to bonding, primarily for phenolic adhesives. In Part I of a two-part review, three inactivation mechanisms involving physical responses to overdrying are considered: (1) exudation of extractives to the surface, which lowers the wettability or hides the surface; (2) reorientation of wood surface molecules, which reduces wettability or places for bonding; and (3) irreversible closure of large micropores in cell walls. I believe that extensive evidence from wood bonding and paper sizing research supports the mechanism of extractives-induced low wettability as the cause for inactivation of Douglas-fir and southern pines. Molecular reorientation and irreversible micropore closure are proposed wood inactivation mechanisms that involve loss of wettability and bonding sites.

References

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2007-06-28

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