Rationalizing Internal Bond and Thickness Swell Test Specimen Size

Authors

  • Wei Xu
  • Paul R. Steiner

Keywords:

Horizontal density distribution, internal bond, specimen size, standard, thickness swell, waferboard, wood composites

Abstract

A criterion for rationalizing internal bond and thickness swell test specimen size of wood composite panels is presented, based on the concept of horizontal density distribution. The criterion utilizes the characteristic curve of the horizontal density variation relative to the specimen size. Using specimen sizes within the less sensitive range of the characteristic curve, stable and less variant internal bond and thickness swell results were obtained. Using this criterion for studying the specimen size effect, an equal specimen size of 100 mm x 100 mm is suggested for the internal bond and thickness swell tests of the commercial waferboard material studied. The criterion is recommended for future testing standard development for internal bond and thickness swell specimen size designations.

References

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Published

2007-06-19

Issue

Number 4 / October 1995

Section

Research Contributions

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