Correlation of Waferboard Internal Bond and Wood Failure as Measured by Image Analysis

Authors

  • Simon Ellis

Keywords:

Internal bond, wood failure, image analysis, waferboard

Abstract

Waferboard panels were fabricated using light-colored Populus tremuloides wood flakes and dark-colored liquid or powdered phenol-formaldehyde adhesive. Internal bond (IB) specimens were prepared and tested according to the normal standards. Image analysis techniques were applied to measure the wood failure (WF) values occurring at the surface of the failed IB specimens. Wood failure values were successfully determined when liquid or powdered adhesive was used at a loading of 6% but not at lower adhesive loadings of 2% and 4%. For the adhesives used, the powdered adhesive produced greater WF values than did the liquid adhesive, for a given IB strength. A stronger correlation between WF values and IB strengths was found for the specimens produced using the powdered adhesive than for those specimens produced using the liquid adhesive.

References

American Society for Testing and Materials. 1989. Standard methods of evaluating the properties of wood-base fiber and particle panel materials. ASTM D1037-87. ASTM, Philadelphia, PA.nCanadian Standards Association. 1978. Douglas fir plywood. CSAO121-1978.nEllis, S. C. 1993. Effect of resin particle size on wafer-board adhesive efficiency. Wood Fiber Sci. 25(3):214-219.nMcMillin, C. W. 1982. Applications of automatic image analysis to wood science. Wood Science 14(3):97-105.nMcMillin, C. W. 1984. Evaluating wood failure in plywood shear by optical image analysis. Forest Prod. J. 34(7/8):67-69.nMiller, D. G., Y. Tardiff, and E. G. Bergin. 1973. Video wood-failure evaluator. Forest Prod. J. 23(4):21-26.n

Downloads

Published

2007-06-25

Issue

Number 1 / January 1995

Section

Research Contributions

License

The copyright of an article published in Wood and Fiber Science is transferred to the Society of Wood Science and Technology (for U. S. Government employees: to the extent transferable), effective if and when the article is accepted for publication. This transfer grants the Society of Wood Science and Technology permission to republish all or any part of the article in any form, e.g., reprints for sale, microfiche, proceedings, etc. However, the authors reserve the following as set forth in the Copyright Law:

1. All proprietary rights other than copyright, such as patent rights.

2. The right to grant or refuse permission to third parties to republish all or part of the article or translations thereof. In the case of whole articles, such third parties must obtain Society of Wood Science and Technology written permission as well. However, the Society may grant rights with respect to Journal issues as a whole.

3. The right to use all or part of this article in future works of their own, such as lectures, press releases, reviews, text books, or reprint books.