Recovery of Mechanically Induced Residual Stresses in Densified Softwoods Created During a Densification Process
Keywords:
Densified softwoods, mathematical model, stress recovery, residual stressesAbstract
Mechanical densification technology has been used to increase density and mechanical properties of low-density wood. After the densification process, some internal stresses created during densification can be temporally "locked" in wood, which is defined as mechanically induced residual stresses. When the densified wood is exposed to wet conditions, these mechanically induced residual stresses along with swelling stresses can be released with time, which might result in dimensional instability causing warping. This study aimed at examining mechanically induced residual stresses in densified softwoods and simulating the stress-releasing process by means of a mathematical model. Balsam fir and eastern white pine were used for undensified wood specimens and densified wood specimens that were compressed at three compression ratios (CRs) of 0.25, 0.50, and 0.60. Specimens compressed at 0.50 and 0.60 CR plus one control group of undensifed specimens (ie CR = 0) was used to calculate model parameters, and ones at 0.25 CR were used to verify the model developed. Total residual stresses were directly measured by soaking softwood specimens in hot water of 60°C. It was found that 1) about 50% of maximum total residual stress in densified fir and pine specimens could be released in the first several minutes after soaking in the hot water; 2) the mechanically induced residual stresses increased with increasing CR; 3) the mechanically induced residual stresses released from pine were slightly larger than those from fir; and 4) the mathematical model developed in terms of CR could well simulate the release of mechanically induced residual stress with increasing time.References
Blomberg J, Persson B (2007) Swelling pressure of semi-isostatically densified wood under different mechanical restraints. Wood Sci Technol 41(5):401-415.nCloutier A, Fang CH, Mariotti N, Koubaa A, Blanchet P (2008) Densification of wood veneers under the effect of heat, steam and pressure. Paper AP-3 in Proc 51st SWST International Convention, 10-12 November 2008, Univ Bio-Bio, Concepción, Chile. Society of Wood Science and Technology, Monona, WI. http://www.swst.org/meetings/AM08/proceedings/AP-3.pdf(16 August 2011). http://www.swst.org/meetings/AM08/proceedings/AP-3.pdf'>http://www.swst.org/meetings/AM08/proceedings/AP-3.pdfnFPL (2010) Wood handbook: Wood as an engineering material. Gen Tech Rep FPL-GTR-190. USDA Forest Service, Forest Prod Lab, Madison, WI.nFukuta S, Takasu Y, Sasaki Y, Hirashima Y (2007) Compressive deformation process of Japanese cedar (Cryptomeria japonica). Wood Fiber Sci 39(4):548-555.nGittus JH (1975) Creep, viscoelasticity, and creep fracture in solids. John Wiley & Sons, Inc., New York, NY.nGong M, Nakatani M, Yang Y, Afzal M (2006) Maximum ratios of softwoods produced in eastern Canada. In Proc 9th World Conference on Timber Engineering, Portland, OR. OSU Conference Services, Oregon State University, Corvallis, OR. http://www.ewpa.com/Archive/2006/aug/Paper_306.pdf (23 August 2011). http://www.ewpa.com/Archive/2006/aug/Paper_306.pdf'>http://www.ewpa.com/Archive/2006/aug/Paper_306.pdfnHalligan AF (1970) A review of thickness swelling in particleboard. Wood Sci Technol 4(4):301-312.nInoue M, Norimoto M, Otsuka Y, Yamada T (1990) Surface compression of coniferous wood lumber. 1: A new technique to compress the surface layer. Mokuzai Gakkaishi 36(11):969-975.nIto Y, Tanahashi M, Shigmatsu M, Shinoda Y, Ohta C (1998) Compressive molding of wood by high-pressure steam-treatment. Part 1. Development of compressively molded squares from thinning. Holzforschung 52:211-216.nKamke FA, Kutnar A (2010) Transverse compression behaviour of wood in saturated steam at 150-170°C. Wood Fiber Sci 42(3):377-387.nKamke FA, Sizemore H (2005) Viscoelastic thermal compression of wood. US Patent Application US2005/006004AI.nKutnar A, Humar M, Kamke FA, Sernek M (2011) Fungal decay of viscoelastic thermal compressed (VTC) wood. Eur J Wood Prod 69:325-328.nLamason C, Gong M (2007) Optimization of pressing parameters for mechanically surface-densified aspen. Forest Prod J 57(10):64-68.nNorimoto M (1993) Large compressive deformation in wood. Mokuzai Gakkaishi 39(8):867-874 [in Japanese with abstract in English].nOriginLab (2010). OriginPro 8:SR4. OriginLab Corporation, Northampton, MA.nPerktiny T, Kingston RST (1972) Review of the sufficiency of research on the swelling pressure of wood. Wood Sci Technol 6(3):215-229.nThoemen H, Haselein CR, Humphrey PE (2006) Modeling the physical processes relevant during hot pressing of wood-based composites. Part II. Rheology. Holz Roh Werkst 64(2):125-133.nUhmeier A, Morooka T, Norimoto M (1998) Influence of thermal softening and degradation on the radial compression behavior of wet spruce. Holzforschung 52:71-81.nWang J, Cooper PA (2005) Vertical density profiles in thermally compressed balsam fir wood. Forest Prod J 55(5):65-68.nWu QL, Lee JN, Cai ZY, Zhou DG (2009) Creep behaviour of borate-treated strandboard: Effect of zinc borate retention, wood species, and load level. Maderas-Cienc Tecnol 11(1):19-32.n
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